To drive Lead Frame / Packing Material development activities to ensure the package fulfil all requirement in the aspect of manufacturing, product qualification and reliability.
Your Role
Key responsibilities in your new role
- Technical expert for lead frame / packing material in package development projects.
- Perform design, drawing and specification for lead frame based on design guideline, assembly rules and ensure design for manufacturing, quality and cost.
- Collaborate with internal and material supplier on packing material design, specification and selection; and ensure design for manufacturing, quality and cost.
- Drive lead frame / packing material development activities and ensure fulfilment of project milestone deliverables, cost and documentation release (spec, drawing, GIMM, etc).
- Liaise with SQM and supplier to ensure fulfilment of quality requirement / FAI for lead frame/ packing material; and qualification release.
- Establish design guideline / requirement for lead frame / packing material specification.
- Actively engages with lead frame / packing material suppliers to explore new technology, best in cost design, etc to achieve competitive advantages.
- Generate technical papers / journals and patents related to lead frame / package design that enhances technical value.
Your Profile
Qualifications And Skills To Help You Succeed
- Bachelor's Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics) with 8 years of working experience in semiconductor assembly and packaging development; and relevance experience in Lead Frame / Packing Material is preferred.
- Analytical and problem solving skills.
- Knowledge in material physics / properties for Lead Frame and packing material.
- Material development, analysis, qualification and reliability.
- Lead Frame / packing material development & qualification.
- AutoCAD and 3D inventor drafting skill is a must.
#WeAreIn for driving decarbonization and digitalization.
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Are you in
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