To lead IC package development and new product introduction at subcons. Ensures that technical, quality, schedule and cost requirements are achieved.
Your Role
Key responsibilities in your new role:
- Responsible for all technical aspects of new product/package/new process development.
- Ensure that the project meets customer requirements in terms of timeline, cost and quality.
- Provide and/or review design proposals for package including components.
- Provide technical direction related to problem solving of process and reliability issues.
- Close interaction with the cross functional team for new product design and project roadmaps.
- Work closely with the subcon engineering teams to ensure process readiness and effective execution of development activities to meet Infineon project requirements.
Your Profile
Qualifications and skills to help you succeed:
- Master / Bachelor Degree in Engineering (Minimum requirement 5 Years of Package/Process development in Semiconductor packaging).
- Experience in analytical tools: Delta Analysis, DFMEA, DoE, 8D and simulation.
- Proficient in AutoCAD for 2D drawing. Knowledge using 3D software (AutoCAD 3D, Inventor, & SolidWorks) is an advantage.
- Exposure to the development of a wide variety of packages: MEMS packages, Flip Chip, WLCSP, QFN.
- Understanding/Interpretation of package simulation software ( ANSYS & SolidWorks) for FEA & thermal analysis is an advantage.
- Working knowledge of DFMEA during design phase and ability to create strategy to mitigate risk.
#WeAreIn for driving decarbonization and digitalization.
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Are you in
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