Nexperia is a world-class company in semiconductor development and in-house production. A proven global player with an entrepreneurial mentality. At our core is an 13,000+ strong international network with a singular focus. Built on passion and commitment to our work, belief in our goals and a drive to succeed regardless of the challenges we face. We support, reward and challenge individuals equally, in a dynamic and energetic environment.
About the Role:
We are seeking a
Senior Wire Bond Equipment & Process Engineer to join our dynamic team. In this role, you will leverage your expertise in wire bonding technology to optimize semiconductor manufacturing processes and ensure the highest quality and reliability in production. You will work closely with cross-functional teams, including R&D, process engineering, and manufacturing, to drive continuous improvement and innovation.
What You Will Do:
- Lead the setup, qualification, and optimization/CZ/DOE of wire bonding equipment and processes.
- Develop and implement process improvements to enhance yield, reliability, and throughput.
- Troubleshoot, Disposition and resolve equipment and process issues in a fast-paced production environment.
- Collaborate with design, quality, and manufacturing teams to support new product introductions.
- Analyze process data to identify trends and implement corrective or preventative actions.
- Mentor junior engineers and share best practices within the team.
- Ensure compliance with safety, quality, and environmental standards.
- Update FMEA, Control Plan, OCAP, SPC and other related documents for Equipment and Process.
- Internal and External audit.
- Cost / MVA project and other related project for Equipment and Process.
- Other activities assigned by superior.
What You Will Need:
- Bachelor's degree in Electrical/Electronic Engineering, Mechanical Engineering, Materials Science, or a related field.
- Minimum 5 years of experience in wire bonding equipment and semiconductor process engineering.
- Strong understanding of thermosonic and ultrasonic wire bonding techniques for Gold and Copper. Others wire type handling is a plus.
- Solid Hands-on experience in ASM wire bonders, bonder programming, and process optimization. KNS Hands-on experience is a plus.
- Solid analytical and problem-solving skills, with experience using data to drive decisions.
- Knowledge of semiconductor manufacturing standards, quality control, and reliability testing.
- Statistical Knowledge/Hands-on in JMP, Minitab and/or other statistical tools.
- Excellent communication and collaboration skills; ability to work across teams.
Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright material and the word Nexperia is a registered trademark.
D&I Statement
As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.
In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.
