Senior Wire Bond Equipment & Process Engineer

Senior Wire Bond Equipment & Process Engineer

Location: Tuanku Jaafar Industrial Park, Seremban, Negeri Sembilan

Industry: Semiconductor Manufacturing (Global Integrated Device Manufacturer)

Salary: RM6,000

Qualification: Degree in Engineering (Electrical / Electronic / Mechatronic / Related)

Experience: Minimum 5 years relevant experience

About the Company

A global semiconductor manufacturer with advanced assembly and test operations in Negeri Sembilan is seeking a Senior Engineer to support high-volume production and continuous process innovation. The organization operates within a fast-paced, technology-driven environment serving automotive and industrial markets.

What You Will Do

Lead setup, qualification, optimization (CZ/DOE) of wire bonding equipment and processes

Drive process improvements to enhance yield, reliability, and throughput

Troubleshoot and resolve equipment and process issues in a high-volume production environment

Support new product introductions (NPI) with cross-functional teams (Design, Quality, Manufacturing)

Analyze process data trends and implement corrective / preventive actions

Update and maintain engineering documentation (FMEA, Control Plan, OCAP, SPC)

Manage internal and external audits

Lead cost reduction / MVA projects

Mentor junior engineers and promote engineering best practices

Ensure compliance with safety, quality and environmental standards

What We're Looking For

• Bachelor's Degree in Electrical/Electronic Engineering, Mechanical Engineering, Materials Science or related field
• Minimum 5 years of experience in semiconductor wire bond process engineering
• Strong knowledge of thermosonic & ultrasonic wire bonding (Gold & Copper)
• Hands-on experience with ASM wire bonders (KNS exposure is an advantage)
• Strong DOE, SPC, FMEA knowledge
• Statistical analysis experience (JMP, Minitab or equivalent tools)
• Strong analytical, troubleshooting and cross-functional collaboration skills

Why Join

Exposure to advanced semiconductor manufacturing technologies

Opportunity to drive real process improvement impact

Collaborative engineering-driven environment

Stable global organization with long-term growth opportunities