About The Role
As a Service Engineer within Customer Services, you will be responsible for implementing and executing continuous improvement initiatives to ensure consistent, highquality, and costeffective equipment performance. This role requires onsite, handson support for advanced Die Bonders, flip chip bonders, and die sorters to meet customer expectations.
Roles And Responsibilities
- Provide onsite field service support for advanced Die Bonders, flip chip bonders, and die sorters.
- Perform FAT, SAT, installation, setup, buyoff, process recipe development, troubleshooting, and performance monitoring.
- Understand customer requirements and equipment performance to identify improvement opportunities and translate them into actionable plans.
- Collaborate with crossfunctional teams to deliver effective solutions.
- Execute improvement programs to maintain consistent service quality and operational efficiency.
- Manage customer interactions to build and sustain strong, longterm relationships.
Requirements
- Bachelor's degree in an engineering discipline.
- Minimum 3 years of handson experience in semiconductor equipment maintenance or service.
- Strong communication, problemsolving, and projectmanagement skills.
- Ability to manage customer, stakeholder, and partner expectations effectively.
- High cultural awareness and ability to work with global teams and customers.
- Strong interpersonal skills and a collaborative mindset.
- Proficiency in English and Mandarin for business communication.
- Mature, customeroriented, and resultsdriven.
- Flexibility to work extended hours, including occasional weekend and publicholiday support.
- Willingness to travel frequently as required
Talent acquisition based on ITEC vacancies is not appreciated. ITEC job adverts are ITEC copyright material and the word ITEC is a registered trademark.
ITEC is an Equal Opportunity/Affirmative Action Employer.
