Services Engineer (Semiconductor)

Key Responsibilities:

• Diagnose and resolve technical issues promptly to reduce downtime, especially ondie bondingandwire bonding.
• Perform on-site support activities including routine maintenance, calibration,andequipment servicingfor semiconductor bonding tools.
• Establish and maintain strong customer relationships through regular visits, technical consultations, andservice follow-ups.
• Prepare clear and accurate service reports and follow up on customer inquiries to ensure satisfaction and support long-term business growth.
• Recommend process improvements orequipment upgradesto help customers enhance operational efficiency and productivity.
• Collaborate with internal departments to relay customer feedback for continuous improvement and futureproduct development.
• Ensure all service activities are well-documented and comply with relevantsafety and quality standards.

Requirements:

• At least 3 years of hands-on experience withShinkawa, Kulicke & Soffa, BESI, or ESECsemiconductor equipment.
• Strong technical knowledge in semiconductor backend processes and related equipment.
• Proven troubleshooting, analytical, andproblem-solvingcapabilities.
• Excellent interpersonal skills and a strong focus oncustomer service.
• Willingness to travel regularly to customer sites, especially inKedahand nearby regions.