Responsible for sustaining and improving Die Sort operation.
Responsible for sustaining and improving Chipsales operation.
Interface with Chipsales customers and improve customer satisfaction.
Interface with Die Sort subcons and improve subcons technical capability.
Project leader for die sort strategic projects (automation+capacity ramp). Project leader for global SPC sustainable in Malaysia and in conjunction with other sites.
Requirements:
Bachelor Degree or equivalent qualification in engineering.
Min. 5 years experience in semiconductor high volume manufacturing.
Strong Process technical knowledge with skillsets in Die Sort and project management skills.
