CIP (Continuous Improvement Plans), FMEA (Failure Mode and Effects Analysis), SOP (Standard Operating Process), process formulations

Statistical Process Control (SPC), Design of Experiments (DOE), Automated Defect Classification (ADC) systems, Manufacturing Execution Systems (MES), Automated Optical Inspection (AOI) systems, Pattern Recognition, Image Processing, AI Machine Learning applications, Root Cause Analysis, AOI recipe development, Machine vision technology, Defect classification techniques

engineering DOE evaluations, wire bond Cu Au wire process, tools jigs fabrication, machine modifications, yield improvement, Training

New product introduction (NPI, Flip Chip assembly, Process characterization, Failure Analysis, Process Optimization, Continuous improvement initiatives, Solder bump micro-bump technology, Underfill processes, Reliability Testing, Process Documentation, process transfer