Work Location: Senai, Johor

Monthly Salary: RM 6,100 – RM 8,000 per month

Summary

The successful candidate will be responsible for resolving manufacturing floor test and assembly issues, driving continuous product quality improvements, and reducing test cycle times.

Detailed Description

Performs tasks including, but not limited to, the following:

Yield & Productivity Optimization: Drive initiatives to improve yield, factory productivity, and cycle time.
Factory Floor Support: Troubleshoot production issues, determine root causes, and handle the disposition of rejected materials/components.
Training & Enablement: Provide technical training and guidance to production personnel.
New Product Introduction (NPI): Support NPI processes by developing, documenting, and implementing new manufacturing test procedures and processes.
Test Engineering Development: Design and develop specialized procedures, testing tools, and test fixtures as required.
Specifications Management: Create and define production and characterization test specifications.
Cost & Efficiency Initiatives: Actively participate in projects focused on manufacturing cost reduction and cycle time reduction.
Equipment Calibration & Compliance: Ensure all test equipment is accurately tested, calibrated, and certified in strict accordance with established procedures.
Documentation & Data Archiving: Maintain accurate documentation, and properly record and archive measurement data relating to product parameters and process control performance.

Knowledge, Skills, and Competencies

Education: Bachelor's degree in Electrical/Electronic Engineering or a related field. (Candidates holding a Diploma with more than 5 years of relevant working experience will also be considered).
Industry Experience: A minimum of 5 years of practical testing experience working with semiconductor capital equipment, specifically such as Etch or Deposition products.

Technical Skills & Expertise

Core Electronics: Solid foundational knowledge in electronics, including analog, power, and digital circuits.
Software & Programming: Experience developing test programs using TestStand (or equivalent software course/experience), alongside familiarity with LabVIEW, LabWindows/CVI, or C programming.
Testing Methodologies: Familiarity with high-voltage testing and insulation testing protocols.
Testing & Instructions: Direct experience in creating and developing clear test instructions and procedures.

Professional Competencies

Problem-Solving: Excellent analytical and troubleshooting skills tailored for final product quality testing.
Process Analysis: Ability to analyze manufacturing processes, identify operational gaps or inefficiencies, and execute yield improvement opportunities.
Communication: Strong verbal and written communication skills in English.
Collaboration: Proven ability to work effectively within a fast-paced global team environment and collaborate closely with cross-functional technical teams.

Test Manufacturing Lead Engineer