packaging materials , Sql, Python, Statistical Analysis, Smt, PCB Assembly, board level reliability, Failure Analysis, solder joint reliability, wafer thinning, die attach, wire bond, packaging domains, Experimental Design, Molding, Pcb Layout

Problem-solving, 8D methodology, Microsoft Office Applications, Electrical failure analysis, Data Analysis, Data Collection

raman spectroscopy , Statistical Analysis, defect characterization techniques, Zygo, Test Database systems, failure mode analysis, FIB-SEM, ESCA, TOF-SIMS, OSA, analytical tools such as SEM-EDX, data interpretation methods, data visualization tools Spotfire, FA database systems

raman spectroscopy , Statistical Analysis, Test Database systems, Zygo, data visualization tools Spotfire, ESCA, FIB-SEM, FA database systems, data interpretation methods, TOF-SIMS, SEM-EDX, OSA

raman spectroscopy , Statistical Analysis, Test Database systems, Zygo, data visualization tools Spotfire, ESCA, FIB-SEM, FA database systems, data interpretation methods, TOF-SIMS, OSA, SEM-EDX

signal integrity theory, debugging failure analysis, hardware board level testing, bus protocols and standards, server platform validation