packaging materials , Sql, Python, Statistical Analysis, Smt, PCB Assembly, board level reliability, Failure Analysis, solder joint reliability, wafer thinning, die attach, wire bond, packaging domains, Experimental Design, Molding, Pcb Layout

raman spectroscopy , Statistical Analysis, Test Database systems, Zygo, data visualization tools Spotfire, ESCA, FIB-SEM, FA database systems, data interpretation methods, TOF-SIMS, SEM-EDX, OSA

Statistical Analysis, Process improvement, Process Documentation, Troubleshooting, Data interpretation, Metrology principles, Sputter process engineering

Power Bi, IIOT, Excel, Rpa, Advanced Analytics, Root Cause Analysis, Lean Six Sigma, Mes, Process Mapping, value stream analysis, statistical packages

Power Bi, IIOT, Excel, Rpa, Advanced Analytics, Lean Six Sigma, Mes, Root Cause Analysis, Process Mapping, value stream analysis, statistical packages

Problem-solving, 8D methodology, Microsoft Office Applications, Electrical failure analysis, Data Analysis, Data Collection