Windows Office, fib, Minitab, Fmea, Spc, AFM, 5 Whys, EDX, Sem, Jmp

LED manufacturing processes, Die Attach process development, Minitab, Process development step and statistic, Six Sigma Green or Black Belt, Process engineering knowledge in semiconductors

fib, OBIRCH, Failure Analysis, nanoprobing, Sem

Artificial Intelligence, Thermal emission, Bench test setup, verification fault isolation equipment, silicon level failure analysis, OBIRCH, die de processing, FESEM, nano-probing, fib

Electrical verification, Thermal HS Imaging, Fault isolation methodologies, OBIRCH, 2D 3D X-Ray, CAD and schematic interpretation, C-SAM, Parametric Analyzer, Bench Set Up for Functional Failures, Package level and die level delayering and cross-sectioning, EDX, Physical failure analysis, Root cause analysis methodologies

Machine Learning, Tensorflow, Pytorch, Python, LangChain, RAG architecture, Statistical Tools, Product Characterization, Test Development, Jmp, Ads, RF Testing, Transformers, Data Analysis, Six Sigma

decap, molding encapsulation, Fmea, Spc, Plating, cross-section, 8-D, leadframe design considerations, wirebond processes, X-ray, QC FA tools, Doe, clip bonding, Sem

2D modeling, Prototyping, Die Casting, Mechanical, structural mechanics, ANSYS Simulation Tool, Printed circuit boards, Fmea, Six Sigma, Product assembly, 8D, Product Testing, PDM Windchill, Doe, Machining, Sheet metal stamping, Creo, Plastic injection molding, Product qualification