flip chip, wire bonding, chip component attach, Fmea, MOL processes, Spc, yield data analysis, 8D, optical testing, eutectic bonding, reflow solder, ball jetting, die attach, FOL processes, Doe, Alignment, Dispensing, transfer pick place

SAP PM, burn-in equipment, equipment qualification, Fmea, Spc, Reliability, optical electrical test, precision equipment subsystems, Bonding, photonic assembly, GR, Cp, R, equipment capability, Doe, Msa, Mes, Cpk

Data Analytics, automation systems, equipment control architecture, equipment reliability engineering, predictive maintenance methodologies, OEE improvement initiatives, Plc Programming, robotics integration, plasma physics, vacuum technology, SPC equipment performance monitoring, SECS GEM communication, thin-film deposition, sputtering systems

Data Analytics, equipment control architecture, automation systems, equipment reliability engineering, predictive maintenance methodologies, OEE improvement initiatives, Plc Programming, robotics integration, plasma physics, SPC equipment performance monitoring, SECS GEM communication, vacuum technology, thin-film deposition, sputtering systems

Iso9001, Advanced Semiconductor Packaging, VDA6.3, Fmea, IATF16949, Control Plan, Supplier Quality Management, PCB Assembly