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Showing 4 jobs
Skills:
C, C++, Ms Office, MATLAB, Python, Tcl, Oscilloscope, Fmea, materials science, Reliability engineering, Failure analysis techniques, 8D, Jmp, Semiconductor device physics, Minitab, Knowledge of PCB IC packaging, Root cause analysis methodologies, Multimeter, Microelectronics manufacturing processes
Skills:
Python, Statistical Analysis, C, MATLAB, Tcl, Ms Office, Jmp, Semiconductor device physics, materials science, Failure analysis techniques, PCB IC packaging, Minitab, Reliability engineering, Microelectronics manufacturing processes, Root cause analysis methodologies
Skills:
Statistical Analysis, C, MATLAB, Tcl, Python, Jmp, Semiconductor device physics, materials science, PCB IC packaging, Failure analysis techniques, Minitab, Reliability engineering, Microelectronics manufacturing processes, Root cause analysis methodologies
Skills:
C, MATLAB, Python, Tcl, microelectronics manufacturing processes, IC packaging, materials science, Failure analysis techniques, Jmp, Semiconductor device physics, Pcb, Minitab, reliability engineering, Root cause analysis methodologies
