assembly processes , Microsoft Office, Process Planning, Pfmea, Problem-solving methodologies, Control Plan, Quality Tools

AOI, thermomechanical behavior, Spc, wetting, metrology analytics, optical inspection, Cu pillar microbump metallurgy, finepitch alignment, Microscopy, die attach, flipchip, datadriven problem solving, TCB, semiconductor assembly process

DFM assessment and NUDD risk management, DOE Mechanical and Material Lab Tools Failure Analysis knowledge, Green Belt Black Belt certification, Quality Tools FMEA 8D DMAIC IPC knowledge, SMT material and process development, Stencil design development for new components, SMT AI ML integration development, Statistical Tools Statistical analysis JMP Minitab