Python Programming, Code Analysis, Validation activities, Firmware debugging, Firmware analysis, Firmware design, Issue isolation, Embedded firmware development using C, Low-level software development including assembly language programming, Root cause investigation

Problem Solving Techniques, WLCSP, Dmaic, Fmea, Wafer Sort, Spc, Final Test, Doe, Statistics, 8D, Auditing, ocap, ALR, Reliability Risk assessments, cip, Control Plan, Process Control Documents, 3D RCCA, Capa, e-PCN, Process Specs, Pfmea, eCAR

lasers , Excel, Python, Minitab, Semiconductor photonic devices, Doe, Semiconductor fabrication processes, Jmp

Laser, Microsoft Office Excel, Oscilloscope, Spectrum Analyzer

Ms Office, Coat, silicon processing, lithography, Expose, Cp, Jmp, process development monitoring, Develop, wafer processing, optoelectronics integrated circuits, lift-off, Cpk, photonics

Testing And Commissioning, Electrical installations, Ms Office Excel

Statistical Analysis, wire bonding processes, Fmea, Spc, failure-analysis techniques, Doe, NPI process qualification, bond pull shear testing, Root Cause Analysis