Fmea, reflow, plasma cleaning, finite element simulation, Jmp, structured 8D problem-solving tools, pick place, underfill curing, Minitab, flux engineering, TCB NCP flux-less flow, SPC controls

cmp , Etching, process integration, lithography, deposition, Metrology, wafer fabrication, optical microscopy, yield improvement, defect analysis, Sem, root-cause analysis

uptime , promis , klarity , Rms, Spc, Si-View, 8D, SPC charts, Space, Doe, CAS procedures, SPSR, metrology tools, Ts16949, process matching, Ace, CIP programs, Cp, Jmp, ECN, Oee, TECN, SLDB, DCOP, CPK, mrb

silicon photonics , Process Setup, Training, lithography, Process Margin, Process Stability

google sheets , Standard Operating Procedures (SOPs), User Acceptance Testing (UAT), Ms Excel, Ms Office, Google Workspace, Data Clean-up, Process Mapping, Powerpoint, Ms Word

EHS compliance, SPC tools, Data Analysis, Wafer processing, Process monitoring control, Yield quality defect reduction, Operations equipment support, MES process control and reporting systems, Continuous Improvement

die-assembly tools, flip-chip bonders, semiconductor wafer packaging, photonics packaging processes, CAD drawing tools, wire bonders