Die bond, Active optical alignment, Wire bond, 1.6T products, Ongoing reliability testing, Report Generation, Burn-in, Quality control best practices, Process implementation for optical products, Root cause corrective action, Product Testing, Optical transceiver manufacturing, Debug failure analysis, Optics FA processes and tools, Yield analysis, Quality Management System, Optical assembly processes, Root cause problem solving, Manufacturing BOMs, Data Analysis, Quality standard requirements

Auto Test Equipment, device physics, Advantest 93K, UltraFlex test handler, Semiconductor Manufacturing, debug skills, Test Development, quality management tools, wafer prober, yield analysis