
Search by job, company or skills
Showing 10 jobs
Skills:
test program development , test data analytics, statistical methods, wafer sort, Burn-In, Failure Analysis, Silicon Characterization, test hardware development, Advantest V93K, Load Boards, final test, Burn-In Boards, ATE test development, Probe Cards, yield improvement
Skills:
High-Volume Manufacturing (HVM), Semiconductor Product Engineering, ATE Test Engineering, Burn-In Testing, ATE Test Program Development, OSAT Management
Skills:
Fault diagnostic capabilities, Wafer fabrication processes, Yield improvement, Failure Analysis, Product Test, Physical failure analysis, Electronics engineering fundamentals, Process-integration, Semiconductor device physics
Skills:
Design for Test (DFT), High-Voltage Stress (HVS), logic bist , AEC-Q100, Fmea, Spc, memory BIST, IATF 16949, VDA 6.3, scan ATPG, 8D, Cp, APQP, boundary-scan JTAG, Dmaic, Ppap, Doe, Msa, CPK, Burn-In
Skills:
Ml, Power Bi, Tableau, electronics engineering fundamentals, wafer fabrication processes, Ai, Al, semiconductor device physics, data visualization tools, prompt engineering, Llm, SemiTronix, RAG, product yield big data management, AI-agents, vector database
Skills:
Scripting, Statistics, Verilog simulations, Data analysis tools, Product Engineering, Electrical and Electronics Engineering, CAD Tools
Skills:
oil & gas, Business Development, Product Engineering

Skills:
product compliance , radio frequency , Wireless Technologies, Telecommunications, Technical File Documentation, regulatory expertise, Mechatronics Engineering, Quality Engineering Knowledge Transfer
Skills:
promis , uptime , Rms, Jmp, DCOP, Ts16949, process matching, Si-View, CAS procedures, Spc, CIP programs, 8D, Cp, CPK, SLDB, mrb, Doe, SPSR, Space, TECN, Klarity ACE, ECN, Oee
Skills:
manufacturing processes , Plm, DFA, Root Cause Analysis, Precision manufacturing, Capital Equipment, BOMs, Tolerances, Dfm, Product lifecycle management, Configuration control, Ppap, Process Validation, Corrective actions, Test stations setup, Copy-exact transfer, engineering change management, Engineering Drawings, Semiconductor equipment automation systems, FAI, ECN, Module and system level test protocol, Eco, Continuous Improvement
