Search by job, company or skills

Showing 1 job

Penang, Malaysia

Skills:

WLCSP, Leaded Packages, Thin Wafer Handling, Quality Reliability Requirements of PQFNs, Assembly Engineering, Package Development, SPS Solder Attach Processes, Spc, Process Engineering, wire bonding, QFNs

Early Applicant
Advertisement
Beware of Scammers

We don’t charge money for job offers