8d problem solving , Statistical Process Control (SPC), Failure Mode and Effects Analysis (FMEA), Design of Experiments (DOE), Semiconductor assembly processes, Underfill process development, Minitab, Flip-chip die-level assembly technology, Six Sigma methodologies, Jmp

FMEA development and writing, EHS compliance, Spc, plating chemistries, bath control, plating process equipment, ERP systems, Mes, Root Cause Analysis

mechanical assembly , mechanical inspection , manufacturing processes , Fmea, Sheet Metal Fabrication, Spc, Control Plans, Ppap, Cnc Machining, Metrology, Die Casting, Supplier Quality Engineering, Msa

Jmp, DOE methodologies, 8D methodologies, Fmea, Spc

Solidworks, Spc, Lean Manufacturing, Doe, Pfmea, Six Sigma

8d problem solving , mechanical assembly , leak testing , Certified Six Sigma Green Belt, Lean Manufacturing, Cleanroom Assembly, Fmea, Pfmea, Root Cause Analysis, Cleaning, Process Development, In-process quality controls

CPK, wire bonding, statistical methods, process characterization, Doe, Troubleshooting, Spc, process setup optimization, die bonding, Data Analysis, Trend Analysis, yield improvement