Pre Assembly and Assembly - Die Attach FC UF, Design of Experiments (DOEs), Statistical Analysis, Recipe knowledge, Metrics Tracking, process monitoring, Risk Assessment, Fmea, Spc, Excursion Management, Process simulation software, Control Plan, Capa, APC, Reporting and Documentation, Doe, Simulation and Testing

Process Engineering, SPS solder attach processes, Assembly Engineering, Spc, NPI-to-production transfers, OSAT and contract manufacturing relationships, Package development, Thin wafer handling, Statistical analysis software such as JMP, PQFN Power Quad Flat-No lead packages, wire bonding, Material process design, Product Lifecycle Management, SPS Smart Power Stage products, Change-management with suppliers, Cu Clip Thin Die Power QFN

Process Documentation, PLC-controlled machinery, statistical software, Conveyors, BOM Control Plan, Robotic Systems, automated assembly lines, process flow diagrams, Pfmea

GaN, gaas, InP, MOCVD technique, SiC, statistical analysis programs

Statistical Process Control Software, Lab tool test measurement equipment, Analytical and statistical analysis

Solidworks, CAD software, moldflow, EDM grinding, mold qualification, thermoplastic materials, Process Validation, hot runner systems, advanced gating techniques, scientific molding principles, injection molding processes, mold flow simulation, mold construction, Lean Manufacturing, plastic injection molding, Six Sigma, Siemens Nx

statistical data analysis , tolerance analysis , Fmea, Lean, Project Management, Design of experiment, precision machining, Six Sigma, CAD Tools

Statistical Analysis, Problem Solving, Supplier Quality Systems Expertise, Material controls, Supplier compliance, Change Control, Risk management

Solidworks, Excel, wire bonding, 3D CAD software, die attach, optical alignment, E-drawings, Optics, six-sigma, statistical analysis tool JMP, photonic