ball jetting, wire bonding, transfer pick place, yield data analysis, Fmea, Spc, Alignment, chip component attach, optical testing, 8D, Dispensing, MOL processes, reflow solder, flip chip, FOL processes, die attach, Doe, eutectic bonding

Regression Analysis, Hypothesis Testing, data mining, Data Analysis, statistical analysis tools, Spc, Doe, Jmp, Failure Analysis, yield models