Physical Failure Analysis (PFA), assembly processes , fib, Package evaluation and qualification, Wafer fabrication, Physical characterization, Root-cause analysis, Chip structure optimization, Advanced semiconductor packaging, Failure Analysis, ASIC technologies, Package Design, Sem

Ms Excel, Solidworks, Geometric tolerance, Preventive maintenance programs, Technical Writing, Diagnostic tools and equipment for troubleshooting, 3D CAD Design Software

Design of Experiments (DOE), Technical Leadership, Quality Assurance, SI PI simulation and validation, Lean, Project Management, Customer Stakeholder Management, design for manufacturing, Lean and Quality mindset, Embedded electrical and electronic product design, 8D Corrective Actions

sputtering equipment, thin-film deposition techniques, preventive maintenance programs, PLC programming and automation, Microsoft Word, Six Sigma methodologies, diagnostic tools and equipment for troubleshooting, vacuum systems

test processes , automated test equipment, Root Cause Analysis, precision measurement systems, Doe, Lean Manufacturing, Pfmea, calibration processes, Six Sigma

Access, automation, Excel, Preventive Maintenance, thin-film deposition techniques, Powerpoint, diagnostic tools, Six Sigma methodologies, Microsoft Word, Plc Programming, sputtering equipment, vacuum systems

5-Why, Iso 9001, Fmea, corrective and preventive actions, Automotive quality requirements, quality-management systems, IATF 16949, 8D, ESD controls, root-cause analysis, structured problem solving