Statistical Analysis, SAP, Power Bi, Tableau, Root Cause Analysis, Fmea, Process improvement, Spc, Productivity Improvement, Jmp, Risk Assessment, Problem-solving methodologies, Minitab, Defect reduction, yield enhancement, Doe, Manufacturing process control, Mes

8d problem solving , leak testing , mechanical assembly , Process Development, Root Cause Analysis, Fmea, Cleaning, Cleanroom Assembly, In-process quality controls, Certified Six Sigma Green Belt, Pfmea, Lean Manufacturing

Process Engineering, SPS solder attach processes, Assembly Engineering, Spc, NPI-to-production transfers, OSAT and contract manufacturing relationships, Package development, Thin wafer handling, Statistical analysis software such as JMP, PQFN Power Quad Flat-No lead packages, wire bonding, Material process design, Product Lifecycle Management, SPS Smart Power Stage products, Change-management with suppliers, Cu Clip Thin Die Power QFN

wafer sputtering, wafer coating, wafer inspection, Minitab, Spc, Doe, wafer backgrind, CpK, wafer saw

semiconductor Backend manufacturing processes integration, Data Analytical, LED assembly processes, spray coating, Statistical Process Control

Spotfire, Minitab, Spc, Doe, Jmp, Problem Solving

Solidworks, Excel, wire bonding, 3D CAD software, die attach, optical alignment, E-drawings, Optics, six-sigma, statistical analysis tool JMP, photonic

Spotfire, Minitab, Spc, Doe, Jmp, Problem Solving