process recipes, Oos, OOC, Spc, process stability, signal-to-noise ratio, FDC, profile control, process control system, etch processes, real-time problem analysis

Statistical Analysis, Minitab, Spc, Doe, semiconductor backend assembly processes, process control techniques, Jmp

Underfill dispensing and curing processes, DOE and statistical analysis, Asymtek NSW and leading dispensers or equivalent equipment, Process characterization and optimization, Failure analysis methodologies, Root cause analysis methodologies, Semiconductor packaging fundamentals, Yield improvement techniques, SPC FMEA Control Plans