Statistical Analysis, Spc, DMAIC methodology, Lean Manufacturing, Doe, Msa, Lean Six Sigma

ball jetting, wire bonding, transfer pick place, yield data analysis, Fmea, Spc, Alignment, chip component attach, optical testing, 8D, Dispensing, MOL processes, reflow solder, flip chip, FOL processes, die attach, Doe, eutectic bonding

Statistical Process Control (SPC), Design of Experiments (DOE), Thermal-Compression Bonding (TCB), Python, Sql, Data Analysis Techniques, Equipment Automation

Regression Analysis, Hypothesis Testing, Jmp, Data Analysis, Li-ion battery technology, statistical analysis tools, Spc, Doe