Pre Assembly and Assembly - Die Attach FC UF, Design of Experiments (DOEs), Statistical Analysis, Recipe knowledge, Metrics Tracking, process monitoring, Risk Assessment, Fmea, Spc, Excursion Management, Process simulation software, Control Plan, Capa, APC, Reporting and Documentation, Doe, Simulation and Testing

PQFN Power Quad Flat-No lead packages, SPS solder attach processes, Package development, Product Lifecycle Management, Change-management with suppliers, Assembly Engineering, Spc, Material process design, Thin wafer handling, NPI-to-production transfers, Statistical analysis software such as JMP, SPS Smart Power Stage products, wire bonding, OSAT and contract manufacturing relationships, Cu Clip Thin Die Power QFN, Process Engineering

8d problem solving , mechanical assembly , leak testing , Certified Six Sigma Green Belt, Lean Manufacturing, Cleanroom Assembly, Fmea, Pfmea, Root Cause Analysis, Cleaning, Process Development, In-process quality controls

Statistical Process Control (SPC), Failure Modes and Effects Analyses (FMEA), Standard Operating Procedures (SOPs), EHS compliance, Plating surface treatment, Electrochemical processes

assembly processes , statistical process control (SPC), analytical tools, PCBA, Wave Soldering, Smt