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Malaysia, Melaka

Skills:

Test Methodologies, semiconductor test equipment, semiconductor physics, packaging technology, electrical characteristics of semiconductor devices, Adapter Socket, maintenance, T32, test recipe, Test Package buy-off release, Automatic Test Equipment Handler, reliability testing methodologies, Troubleshooting, wafer technologies, Tester Handler, equipment troubleshooting, Tri-temperature testing, electronic circuitry, REALIS projects, diagnostic test program debugging, automatic data transfer, tester data file format, test package release, AMSA, reliability reference standards, Thermostream hardware, drift analysis

Early Applicant
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