laser marking , Fmea, Spc, cut singulation, Control Plan, Auto VI machine inspection, 8D, transfer molding, problem-solving methodologies, Rca, Doe, Pfmea, Six Sigma

FMEA development and writing, EHS compliance, Spc, plating chemistries, bath control, plating process equipment, ERP systems, Mes, Root Cause Analysis

Jmp, DOE methodologies, 8D methodologies, Fmea, Spc

Solidworks, Spc, Lean Manufacturing, Doe, Pfmea, Six Sigma

Statistical Process Control, Sop, Spc, FDC, process improvement projects, equipment qualification, fault detection classification charts, Cas

engineering DOE evaluations, wire bond Cu Au wire process, tools jigs fabrication, machine modifications, yield improvement, Training

New product introduction (NPI, Flip Chip assembly, Process characterization, Failure Analysis, Process Optimization, Continuous improvement initiatives, Solder bump micro-bump technology, Underfill processes, Reliability Testing, Process Documentation, process transfer