Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today's needs and tomorrow's next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we're living in and that we have the power to shape.

Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.

Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.

Description

ESSENTIAL DUTIES AND RESPONSIBILITIES:

Responsible for the Underfill (UF) process for flip-chip die-level assembly.
Support Assembly Process Engineering in delivering process and equipment solutions that meet quality, development, and operational requirements.
Maintain assembly yield and assembly test yield related to the Underfill process in line with department targets and KPIs, including lot bracketing and disposition.
Set up new Underfill processes, materials, and recipes, including process window studies, DOE execution, and corner limit evaluations.
Establish golden recipes for new package qualifications.
Maintain Underfill recipe templates according to Positrol log guidelines.
Lead process qualifications to achieve CTQ requirements, CPK targets, risk assessment requirements, UPH, yield, and cost objectives.
Lead new product qualifications and ensure effective process handover and technology transfer.
Support the qualification of new materials, equipment, and tools.
Perform root cause analysis and problem-solving using methodologies such as 5M+1E, 5 Whys, DMAIC, and 8D.
Monitor and optimize Underfill equipment performance, including preventive maintenance coordination and troubleshooting of process deviations.
Develop and maintain comprehensive process documentation, including work instructions, process specifications, and technical reports for regulatory compliance and knowledge retention.
Collaborate with cross-functional teams including Quality, Manufacturing, and Product Engineering to resolve process issues and implement continuous improvements.
Provide technical training and mentoring to assembly technicians and junior engineers on Underfill process best practices and equipment operation.
Carry out additional tasks and responsibilities assigned by the direct and indirect managers.

Qualifications

REQUIRED:

Bachelor's Degree or higher in Engineering (Electrical, Mechanical, Physics, Materials Science, Chemical Engineering, or a related field).
1-2 years of relevant working experience in semiconductor manufacturing, assembly, packaging, process engineering, or related engineering fields.
Basic understanding of semiconductor assembly and packaging processes.
Fundamental knowledge of flip-chip assembly, underfill processes, or semiconductor manufacturing technologies.
Strong analytical, troubleshooting, and problem-solving skills.
Basic understanding of engineering and statistical concepts.
Knowledge of Microsoft Excel and data analysis techniques.
Willingness to work in a fast-paced manufacturing environment and support production operations.
Good communication, teamwork, and interpersonal skills.

Preferred

Experience in semiconductor manufacturing, process engineering, electronics packaging, or related industries.
Exposure to Underfill process development, optimization, troubleshooting, or production support.
Familiarity with semiconductor assembly processes and flip-chip die-level assembly technologies.
Basic understanding of process quality tools, including: FMEA, SPC, DOE, 8D Problem Solving, Six Sigma methodologies.
Exposure to statistical software such as Minitab, JMP, MATLAB, Python, or equivalent analytical tools.
Familiarity with Nordson dispensing systems, Heller reflow ovens, and C-Scan inspection equipment is an added advantage.
Basic understanding of underfill defect mechanisms such as voiding, fillet irregularities, incomplete fill, delamination, overflow, and package warpage.
Familiarity with NPI, HVM, process transfer, or manufacturing ramp-up activities.
Basic knowledge of reliability qualification requirements, including MSL, TCT, HTS, HAST, and Board-Level Reliability testing.
Exposure to failure analysis techniques such as SEM, SAM (C-Scan), X-ray, and cross-section analysis is an added advantage.

Skills

Strong willingness to learn and develop technical expertise in semiconductor assembly processes.
Excellent analytical and critical-thinking skills.
Effective communication and interpersonal skills
Ability to work collaboratively in cross-functional teams.
Good organizational and time management skills.
Proactive attitude with strong ownership and accountability.
Basic data analysis and report-writing skills.
Ability to interpret technical documents, specifications, and engineering drawings.
Strong attention to detail and commitment to quality.
Self-motivated with the ability to work independently under guidance.
Continuous improvement mindset and eagerness to contribute to yield, quality, and productivity improvements.

Additional Information

Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [HIDDEN TEXT] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.

Associate Process Engineer