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Analog Mixed-Signal Layout Engineer

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Job Description

We are looking for experienced Analog Mixed-Signal Layout Engineers to join our semiconductor design team. In this role, you will be responsible for the physical implementation of high-performance analog and mixed-signal IPs using advanced process technologies. You will work closely with circuit designers to deliver high-quality, manufacturable layouts that meet stringent performance, reliability, and timing requirements.

Key Responsibilities

  • Perform full-custom layout design for analog and mixed-signal circuits using Cadence layout tools.
  • Develop layouts for high-speed I/O circuits, including SerDes, DDR I/O, and other high-speed interfaces.
  • Implement layouts for analog IPs such as PLLs, DLLs, LDOs, Bandgap References, and other precision analog circuits.
  • Create and optimize I/O floorplans and power delivery planning to achieve performance, area, and reliability targets.
  • Design and verify I/O ESD protection layouts and perform ESD-related layout analysis.
  • Support advanced packaging implementation, including C4 bump planning and Redistribution Layer (RDL) layout.
  • Ensure layouts comply with advanced process node design rules, reliability, matching, symmetry, and parasitic requirements.
  • Perform layout verification, including DRC, LVS, ERC, and parasitic extraction (PEX), and collaborate with circuit designers to resolve layout-related issues.
  • Work closely with design, verification, packaging, and process engineering teams throughout the development cycle.

Required Qualifications

  • Bachelor's, Master's, or Ph.D. in Electrical Engineering, Electronics Engineering, or a related field.
  • Experience in full-custom analog and mixed-signal IC layout.
  • Strong knowledge and hands-on experience in one or more of the following:
  • SerDes I/O, DDR I/O, or other high-speed I/O layouts
  • PLL and DLL layout implementation
  • LDO, Bandgap, and analog power management circuits
  • Pure analog circuit layout
  • I/O floorplanning and power delivery planning
  • I/O ESD layout and analysis
  • C4 bump and Redistribution Layer (RDL) implementation
  • Proficiency with Cadence layout tools (Virtuoso Layout XL or equivalent).
  • Solid understanding of DRC, LVS, ERC, parasitic extraction (PEX), electromigration (EM), IR drop, and reliability considerations.
  • Strong knowledge of analog layout techniques, including device matching, common-centroid layout, shielding, guard rings, symmetry, and noise isolation.

Preferred Qualifications

  • Experience with advanced semiconductor process technologies of 7nm or below.
  • Hands-on layout experience in Samsung 5nm or below process technologies is a strong advantage.
  • Familiarity with advanced packaging technologies and high-speed interface layout optimization.
  • Experience collaborating with analog circuit designers from floorplanning through silicon validation.

Experience Levels (Hiring Plan)

  • 2–4 years: 5 openings
  • 4–6 years: 5 openings
  • 6–8 years: 5 openings
  • 8+ years: 5 openings

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About Company

Job ID: 151351829

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