Engineer, Process Development Engineering
Analog Devices, Inc. (ADI)- Posted 13 hours ago
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Job Description
About Analog Devices
Analog Devices, Inc. (NASDAQ: ) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at and on and .
1. Develop, qualify, and optimize Die Attach and Flip Chip assembly processes for semiconductor packaging.
2. Provide process engineering support for production lines, including troubleshooting yield and quality issues.
3. Perform process characterization, DOE (Design of Experiments), and process optimization to improve performance and reliability.
4. Support new product introduction (NPI) and process transfer from development to high-volume manufacturing.
5. Work closely with equipment, materials, and product engineering teams to resolve process-related issues.
6. Establish and maintain process documentation, specifications, and control plans.
7. Drive continuous improvement initiatives to enhance yield, productivity, and cycle time.
8. Analyze failure modes and reliability concerns related to die attach and flip chip processes.
9. Interface with equipment vendors and material suppliers to qualify new technologies and improvements.
10. Ensure compliance with quality standards and manufacturing best practices.
Qualifications
1. Bachelor's or Master's degree in Electrical Engineering, Materials Science, Mechanical Engineering, or related field.
2. 3-10 years of experience in semiconductor packaging or assembly manufacturing.
3. Hands-on experience with Die Attach and Flip Chip processes in a production environment.
4. Strong knowledge of:
a. Die bonding techniques
b. Flip chip assembly
c. Underfill processes
d. Solder bump / micro-bump technology
e. Familiarity with advanced packaging technologies is an advantage (e.g., WLCSP, BGA, SiP, 2.5D/3D packaging).
5. Strong problem-solving and cross-functional communication skills.
6. Experience with die attach equipment (ASM, BESI, Datacon, etc.).
7. Familiarity with reliability testing and failure analysis.
Job Req Type: ExperiencedRequired Travel: Yes, 10% of the timeShift Type: Normal Time (Philippines)More Info
Key Skills
Flip Chip assembly
Process characterization
New product introduction (NPI)
Continuous improvement initiatives
Underfill processes
Solder bump micro-bump technology
About Company
Analog Devices, Inc. (NASDAQ: ADI ) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X . Come join ADI - a place where Innovation meets Impact. For more than 55 years, Analog Devices has been inventing new breakthrough technologies that transform lives. At ADI you will work alongside the brightest minds to collaborate on solving complex problems that matter from autonomous vehicles, drones and factories to augmented reality and remote healthcare. ADI fosters a culture that focuses on employees through beneficial programs, aligned goals, continuous learning opportunities, and practices that create a more sustainable future.
