Equipment Engineer (Advanced Packaging- Fan Out)
Equipment Engineer (Advanced Packaging- Fan Out)
tf-amd penangEarly Applicant
- Posted 7 months ago
- Be among the first 10 applicants
Job Description
Responsibilities:
- Set-up each Fan Out equipment and process for high volume mass production.
- Sustain equipment condition to archive the required process requirement
- Set-up / planning of preventive maintenance and materials for each equipment to sustain its best performance
- Verify the corrective action for equipment trouble & spare parts control
- Equipment lifecycle management: Preventive Maintenance, Budget Planning and Administration, Included All Related Expenses.
- Define all equipment material related factors and shoot the equipment and process trouble
Key Areas Involved:
- Photolithography; or
- Sputtering / Electroplating / Etching; or
- Yield / SPC improvement; or
- Grinding / Dicing; or
- FCBGA / COW
Requirements:
- Bachelor's degree in Science and Engineering related majors
- More than 3 year of experience in related key areas modules and wafer level processes
- Good communication in English and proficiency in MS office.
- Basic knowledge of FMEA and DOE.
- Understand SPC principles and possess the ability to perform relevant analyses.
- Master quality management knowledge and common analysis tools, including SPC, 8D, and DOE.
- Acquire expertise in the process and workflow of relevant operations, understanding process requirements, product quality benchmarks, and the materials in use.
- Be well-versed in the performance, operation, and debugging methods of equipment and process.
- Understand electrostatic discharge precautions and requirements.
- Strong self-disciplined and teamwork skills.
- Able to work in Batu Kawan Site
More Info
Job Type:
Industry:
Function:
Employment Type:
Key Skills
FCBGA COW
Yield SPC improvement
