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TF-AMD Penang

Equipment Engineer (Advanced Packaging- Fan Out)

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  • Posted a month ago

Job Description

Responsibilities:

  • Set-up each Fan Out equipment and process for high volume mass production.
  • Sustain equipment condition to archive the required process requirement
  • Set-up / planning of preventive maintenance and materials for each equipment to sustain its best performance
  • Verify the corrective action for equipment trouble & spare parts control
  • Equipment lifecycle management: Preventive Maintenance, Budget Planning and Administration, Included All Related Expenses.
  • Define all equipment material related factors and shoot the equipment and process trouble

Key Areas Involved:

  • Photolithography; or
  • Sputtering / Electroplating / Etching; or
  • Yield / SPC improvement; or
  • Grinding / Dicing; or
  • FCBGA / COW

Requirements:

  • Bachelor's degree in Science and Engineering related majors
  • More than 3 year of experience in related key areas modules and wafer level processes
  • Good communication in English and proficiency in MS office.
  • Basic knowledge of FMEA and DOE.
  • Understand SPC principles and possess the ability to perform relevant analyses.
  • Master quality management knowledge and common analysis tools, including SPC, 8D, and DOE.
  • Acquire expertise in the process and workflow of relevant operations, understanding process requirements, product quality benchmarks, and the materials in use.
  • Be well-versed in the performance, operation, and debugging methods of equipment and process.
  • Understand electrostatic discharge precautions and requirements.
  • Strong self-disciplined and teamwork skills.
  • Able to work in Batu Kawan Site

More Info

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About Company

Job ID: 141414945