System Availability: Execute preventive (PM) and predictive maintenance to maximize Tool Availability and Mean Time Between Failures (MTBF).
Rapid Response Troubleshooting: Diagnose complex hardware/software failures on wafer fabrication equipment. Lead Root Cause Analysis (RCA) to eliminate repeat issues and minimize Mean Time to Repair (MTTR).
Process Synergies: Partner with Process Engineers to optimize equipment parameters, aiming for improved CPK (Process Capability Index) and overall wafer yield.
Continuous Improvement: Identify and implement hardware upgrades or modifications to enhance tool performance and safety.
Quality & Compliance: Perform precise calibrations and validations to ensure equipment meets stringent process specifications and safety standards (e.g., EHS, ISO).
Data-Driven Monitoring: Utilize Statistical Process Control (SPC) and FDC (Fault Detection and Classification) to monitor tool health and pre-emptively address drifting parameters.
Knowledge Transfer: Maintain technical documentation, including SOPs and OCAPs (Out-of-Control Action Plans). Provide technical mentorship to junior technicians.
JOB REQUIREMENTS:
Education: Bachelor's Degree in Electrical, Mechanical, Mechatronic Engineering, or related technical field.
Experience: Minimum 5 years of Equipment Engineering experience in a Semiconductor / Wafer Fab environment (Cleanroom experience required).
Shift Flexibility: Must be available to work rotating shifts, including weekends or nights, to support continuous 24/7 manufacturing operations and emergency tool recovery.
Leadership: Proven ability to mentor technical teams and balance urgent production priorities with long-term tool reliability goals.
Fresh Graduates: Fresh graduates are encouraged to apply.
Communication: Strong verbal and written communication skills, with the ability to document processes and procedures clearly and effectively.
Technical & Soft Skills
Domain Expertise: High proficiency with specific wafer fab platforms (e.g., Lithography, Etch, PVD/CVD, or Metrology).
Methodology: Strong grasp of SPC, FMEA, 8D Problem Solving, and Lean Manufacturing principles.
Automation: Familiarity with PLCs, robotics, and SECS/GEM communication protocols is a plus.
Soft Skills: Resilient under pressure, high attention to detail, and a proactive owner mindset regarding equipment health.
Work Environment
Cleanroom Protocol: Ability to work in a Class 10/100 cleanroom environment, which requires wearing full bunny suit PPE for extended periods.
