N
NPI Process Development Engineer
N
NPI Process Development Engineer
Nxp Semiconductors3-6 Years
- Posted 8 hours ago
- Be among the first 10 applicants
Job Description
- Responsible to develop and qualify new LQFP & BGA packages for total assembly processes in automotive applications.
- Responsible for quality, yield, cost and process improvement activities.
- Responsible for process documentation, process spec, standard work instruction, OCAP, QIT etc.
- Need to collaborate closely with cross functional team members to resolve conflicts and make fast decision to avoid any risk to the organization/company/customer.
- Take ownership to work closely with upper management to align scope and direction of key projects.
- 3-6 years of work experience with semiconductor assembly background for automotive customers.
- Experience in LQFP, MAPBGA, SiP, FCCSP, FCBGA etc. packing development will be an added advantage.
- Good technical knowledge and hands-on experience in process characterization for key processes such as laser dicing, plasma dicing, mechanical saw, die bond, wire bonding, mold, ball attach, marking, singulation etc.
- Candidate must have great interpersonal skills, leadership skills, result orientated, self-driven and eager to strive for success.
- Good SPC, Process Control and other relevant statistical & problem-solving skills
- Good in Microsoft application (PowerPoint, Excel Macro, Word, etc.). Project Management knowledge is an added advantage.
More Info
Job Type:
Industry:
Function:
Employment Type:
Key Skills
plasma dicing
laser dicing
die bond
semiconductor assembly
mold ball attach
FCBGA
process characterization
SPC Process Control
mechanical saw
FCCSP
singulation
MAPBGA
About Company
