Summary
We are seeking an experienced Operations Engineering Manager to lead our Printed Circuit Board Assembly (PCBA) hardware team. The ideal candidate will have a strong background in New Product Introduction (NPI) within a High-Mix, Low-Volume (HMLV) manufacturing environment. You will be responsible for driving continuous improvements in manufacturing processes to enhance yield, quality, and cost-efficiency.
Key Responsibilities
NPI & Manufacturing Leadership:
- Oversee the entire NPI lifecycle for PCBA, ensuring a seamless transition from design and prototyping to mass production.
- Collaborate closely with design teams, customers, and suppliers to meet Design for Manufacturing/Test (DFM/DFT) standards.
- Actively resolve technical challenges that arise during prototyping, pilot runs, and production ramp-ups.
Process Optimisation & Continuous Improvement:
- Develop and refine flexible PCBA processes specifically optimised for HMLV production to ensure efficiency.
- Lead root cause analysis (RCA) for any PCBA failures and implement effective corrective actions.
- Implement Lean manufacturing and Six Sigma methodologies to improve first-pass yield, eliminate waste, and reduce costs without compromising quality.
- Manage BOM optimisation, handle component obsolescence, and develop alternate sourcing strategies.
Team & Stakeholder Management:
- Mentor and guide engineers and technicians within the manufacturing teams.
- Work cross-functionally with Test Engineering, Operations, and QA to ensure total product reliability.
- Provide clear technical and project updates to senior management.
Required Qualifications
- A Bachelors or Masters degree in Electrical/Electronics Engineering or a related technical field.
- 8+ years of experience in PCBA manufacturing or NPI, including at least 3 years in a leadership capacity.
- A proven track record in an HMLV manufacturing environment with demonstrated success in yield improvement and cost reduction.
- Expertise in IPC standards such as IPC-A-610 and IPC-7351.
- Proficiency in applying Six Sigma, Lean, and Kaizen methodologies.
- Strong skills in problem-solving, stakeholder management, and data-driven decision-making.
- Previous experience in a manufacturing engineering role focused on PCBA.
- Knowledge of thermal and mechanical stress analysis for product reliability.
- A background in product compliance for industrial and test measurement equipment.
