

Search by job, company or skills

Position Overview
The incumbent will act as the bridge between R&D, New Product Development and high-volume manufacturing (both in-house and with contract manufacturers). This role is responsible for ensuring new optical engine, module‐level products transition smoothly into production, meet performance and quality goals, and achieve acceptable yield and cost metrics. The incumbent will collaborate closely with cross‐functional teams - design, manufacturing, quality, supply chain, and external partners - to deliver reliable products on schedule.
Responsibilities
Qualifications & Requirements
Job ID: 152279659
Skills:
wire bonding, flip chip, chip component attach, Fmea, MOL processes, Spc, yield data analysis, 8D, optical testing, eutectic bonding, reflow solder, ball jetting, die attach, FOL processes, Doe, Alignment, Dispensing, transfer pick place
Skills:
flip chip, wire bonding, chip component attach, Fmea, MOL processes, Spc, yield data analysis, 8D, optical testing, eutectic bonding, reflow solder, ball jetting, die attach, FOL processes, Doe, Alignment, Dispensing, transfer pick place
Skills:
Test flow design, Memory test process, System test process, Data analysis tools, Failure analysis of memory and system failures
Skills:
I.C. design, synopsys primetime , Shell, Perl, Python, Tcl, Cadence Genus, Cadence Tempus, Synopsys DesignCompiler, ASIC Design, System-Verilog, RTL2GDS implementation
Skills:
Dac, Python Scripting, Automation Frameworks, Circuit Design, Layout and verification, Oscillators, IC design methodologies, Analog IC design, Temp Sensors, ADC, Switched regulator, Bandgap amplifier, Mixed Signal IC design