Remark: Join an exciting new project and this will be based at our temporary facility in Prai. This role will be located there for approximately 2–3 years, with the opportunity to transition to our Batu Kawan plant as the project evolves.
Job Responsibilities:
- Management of product sustaining activities which include driving product performance improvement (yield, quality, etc.) and cost reduction.
- Drive on VM yield improvement across processes. Manage yield performance with customer and work on baseline yield improvement.
- Managing the sustaining process and executing independently BOM (Bill of Material) project for New Advanced Technology Products, Design of Experiment (DOE) and processes.
- Managing the engineering activities during new product development including product definition, performance characterization, qualification, and release to production.
- Manage product ramp to yield entitlement.
- Managing the Quality matter with the approach of Statistical data analysis (Statistical Validation), 8 basic QC tools and FMEA.
- Drive all margin issues with operations and development teams.
- Work with the Manufacturing, Design, Quality, and equipment team in the disposition of product excursions and manage cases through a material review board.
- Train, develop and retain Engineer with the sustaining process specialized in Flip Chip Ball Grid Array (FCBGA).
Job Qualifications:
- Require at least 5 years of experienced in IC packaging.
- Candidate must possess at least Bachelor's Degree/Post Graduate Diploma/Professional Degree in Engineering (Computer/Telecommunication), Engineering (Electrical/Electronic), Engineering (Mechanical), Engineering (Mechatronic/Electromechanical) or equivalent.
Required Skills
Preferred Skills
- Preferred to have some fundamental levels of knowledge in vision inspection equipment, PnP handler, mechanical design.
