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Senior Engineer
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Senior Engineer
denselight semiconductors pte ltd- Posted 26 days ago
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Job Description
Job responsibilities
- Assembly and packaging process improvement and optimization in systematic manner
- Documentation for key assembly and packaging processes, and implementation of effective process control practices to achieve repeatability of quality assembly process
- Propose, evaluate and refine current process steps for yield and capacity improvements
- Documentation and implementation of preventive and corrective action, and best-known methods to allow more efficient process troubleshooting
- Qualification of new assembly and packaging related direct materials
- Buyoff and release of new assembly and packaging equipment
- Analyze process out of control and failures, and develop corrective actions accordingly
- Monitor process performance and suggest improvements
- Work with specialists/vendors to design and develop new process
- Ensure compliance with ISO standards and support audit functions
- Provide support for customer returns
- Perform process qualification before handing off to production
- Develop cost-reduction initiatives while still maintaining quality and productivity
- Aligning and supporting packaging roadmaps, developing and optimizing processes to improve product quality and reliability
- Working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems
Requirements
- Degree in Mechanical Engineering / Material Science
- Minimum 5 years working experience in semiconductor assembly and packaging process
- Ideally with strong semiconductor assembly and packaging process experience and knowledge, deep understanding about processes such as wafer cleaving, die attachment (especially eutectic die attach), wire bonding, etc.
- Strong skills in developing and refining process to enhance yield, reliability and efficiency, with vast hands-on experience in DOE (design of experiment) practice
- Strong analytical skills to identify and resolve process issues effectively
- Ability to develop long-term strategies for process improvement and innovation
- Familiarity with industry standards and regulations related to semiconductor assembly and quality control
- Ability to lead projects and work collaboratively with cross-functional teams
- Able to mentor junior engineers and lead team in process improvement initiatives
More Info
Job Type:
Industry:
Function:
Employment Type:
Key Skills
die attachment
eutectic die attach
semiconductor assembly and packaging process
wafer cleaving
About Company
Skills:
batch records , capas , Defect Management, Reports, media fills, inspection readiness, Cgmp, training records, Process Improvements, assembly and packaging, product lifecycle management, Quality Systems, QRA assessments, Technology Transfer, Continuous Improvement, protocols, audits, POD studies, equipment qualification, GMP documentation, engineering runs, commercial manufacturing operations, Sops, Deviations, manufacturing system, QMS activities, Root Cause Analysis, Risk Assessments, Process Validation, Visual Inspection, Change Controls
Skills:
cmp , Etching, process integration, lithography, deposition, Metrology, wafer fabrication, optical microscopy, yield improvement, defect analysis, Sem, root-cause analysis
Skills:
cmo management , Quality Assurance, FDA-regulated environment, Project Management, Manufacturing processes methodologies, Product Engineering, process integration, Continuous Improvement, Process Control, Analytical Problem Solving, Failure Analysis, Test plans for components materials and systems, Biochemistry process, Wafer fabrication, Back-end packaging assembly, Yield engineering
I
Skills:
Quality Assurance, process integration, Yield engineering, Product Engineering, Failure Analysis, Manufacturing processes methodologies, Engineering tools and software packages, Process Control, Continuous Improvement
Skills:
Statistical Analysis, wire bonding processes, Fmea, Spc, failure-analysis techniques, Doe, NPI process qualification, bond pull shear testing, Root Cause Analysis