Senior Engineer/Engineer, Thin Film Equipment

Job Description:

• To own, maintain and improve the following indices: Quality, Uptime and Cost.
• Sustain equipment KPI and make continuous improvements to enhance the performance.
• Monitor and control equipment performance indices. Optimize PM procedures to make it more effective and efficient.
• Coordinate with both process and manufacturing Engineers to ensure work is carried out efficiently to meet module objectives.
• Manage the logistics for parts so as to prevent prolonged uptime losses in the case of equipment failure.
• Manage the expenditure allocated for equipment maintenance without compromising on quality output.
• Continuous improvement of equipment KPI in terms of quality, uptime and costs.
• Plan and implement an effective Preventive Maintenance program on equipment.
• Coach and Mentor subordinates to ensure that skill level and knowledge are up to date, and continuously give feedback on their work performance.
• Document Corrective Action and Best Known Methods, and Fan it out to all for maximum ROI and learning.
• Participate in CIP programs to optimize equipment utilization and cost of maintenance.
• Become the technical Expert for the respective machine specialization.
• Monitor and analyze SPC charts. Know how to use JMP to analyze engineering experiments.
• Know how to use measurement instruments effectively in data collection.
• Understand FMEA and be able to generate FMEA analysis for new tool. Able to utilize it to identify tool weaknesses and derive the top 3 to 5 risk factors.
• Able to create PROMIS DC OP and SPC charts.
• Coordinate new equipment start-up to support production, from facilities hookup, vendor startup, to acceptance of equipment for production.
• Wafer scrap reduction awareness and mindset.
• Follow up on SPSR, MRB, 8D, TECN, and ECN documentation for closure of issues / events. Provide guidance
• to Junior Engineers.
• Self audit and update specifications to meet TS16949 Quality Standard requirements.
• Set Expectation and carry out performance appraisal for Technician or AE as instructed by
• Section Manager.

Requirements:

• Degree in Electrical / Electronics / Mechanical / Mechatronics / Microelectronics Engineering
• Min 3 years of relevant work experience Wafer fabrication and experience in handling Thin Film Equipment (CVD/PVD).
• Good team player with good interpersonal, communication and written skills
• Strong logical thinking capability and good analytical skill
• High level of integrity with strong leadership attributes to lead and coach a team
• Highly committed with good ownership and accountability
• Able to adapt in a fast pace environment and work under pressure
• Proficient in MS Office Applications