Senior Engineer, Package & Assembly Engineering

About Analog Devices

Analog Devices, Inc. (NASDAQ:) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world. With revenue of more than $9 billion in FY24 and approximately 24,000 people globally, ADI ensures today's innovators stay Ahead of What's Possible. Learn more atand onand.

The Package Engineer will report to Package Development Engineering Manager.

The person responsible to support Thermal and Mechanical simulation. Also, will involve in package development activities.

Key Responsibilities:

• Support New product or customer request on Thermal Simulation work.
• Support Mechanical simulation request.
• Work with in-house assembly or OSAT to qualify new product and package.
• Recommend suitable package for new product.
• Work with substrate design engineer on substrate stackup.
• Work with Design Team to define package Bill of Material.
• Work with Design Team, In-house Assembly or OSAT to define Package Outline.
• Work with REL Team to define qualification plan for new package.

Qualifications

• Bachelors degree in Mechanical Engineering, Materials Science, or related field.
• Minimum of 5 years in semiconductor packaging
• Experience dealing with substrate / PCB supplier on design.
• Experience in Thermal & Mechanical Simulation.
• Understand semiconductor reliability qualification procedure.
• General Substrate fabrication knowledge.
• Semiconductor assembly process knowledge.
• Autocad and engineering drawing knowledge.
• ANSYS and Simcenter FloTherm

Job Req Type: Experienced

Required Travel: Yes, 10% of the time

Shift Type: Normal Time (Philippines)