Kulim, MY
Mar 13, 2026
17794
Be part of our team!
AT&S is a
leading global manufacturer of high-end IC substrates and printed circuit boards. AT&S industrializes leading-edge technologies for its core business segments Mobile Devices & Substrates, Automotive & Aerospace, Industrial and Medical and high-performance computing for AI applications. We are looking for talent eager to
shape the future of our interconnected world. With plants in Austria, China, India, Malaysia and sales offices around the globe, we offer excellent career opportunities for creators, innovators and enablers with the drive to make a difference.
To enhance our successful
Human Resources Team in AT&S Malaysia in Kulim Hi-Tech Park, Kedah, we are looking for a passionate
Senior Program Manager
Summary of Position:
- This position leads the 35year capacity expansion program for IC Substrate manufacturing at the AT&S Kulim campus, executed in close collaboration with a strategic global customer.
- The scope includes the coordination, integration and steering of all related project work packages, ensuring timely, costeffective and qualitycompliant delivery of a USD >400M investment program.
- The Senior Manager acts as the program integrator, aligning internal and external stakeholders, managing interfaces between engineering, facilities, equipment, IT/MES, quality, customer program teams, and ensuring program execution in line with the Kulim Campus 2.0 strategic framework.
- Responsibilities include regular seniormanagement reporting, structured governance, risk management and readiness for customer qualification and rampup.
Your Responsibilities
- Lead and coordinate the endtoend IC substrate capacity expansion program, ensuring full alignment of all work packages (contract, building & infrastructure, layout, equipment, IT/MES, technical capability, qualification, etc.).
- Establish and run program governance incl. steering committees, core team structures, reporting cadence and KPI tracking.
- Act as primary internal program integrator and cross functional alignment owner for Engineering, Facilities, EHS, Procurement, Operations, Quality, IT and Finance.
- Manage and coordinate the customer interface at both operational and senior management levels, including program reviews, alignment of milestones and communication of risks and mitigations.
- Ensure full understanding of customer contract requirements and reflect these in internal planning, deliverables and acceptance criteria.
- Oversee factory, cleanroom and infrastructure readiness: building, utilities, white space planning, equipment layout, and integration with parallel site expansions.
- Drive equipment procurement, source inspection, installation, hook up and release to operations in close collaboration with the responsible technical owners.
- Coordinate IT/OT readiness, including B2B connectivity to customer, MES/ERP integration and cybersecurity requirements.
- Support process and capability enablement, including NPI transfer, golden line setup, yield targets and technical risk resolution.
- Coordinate customer qualification (PCRB, CPK/DOE readiness, reliability tests) in collaboration with Quality and Engineering functions.
- Track program budget, schedule and risks; maintain accurate reporting, forecasts and mitigation actions.
- Proactively integrate the program into the Kulim Campus 2.0 master plan and synchronize with parallel expansions.
- Build and lead a high performance virtual program team (matrix setup); no direct reports initially (first 810 months).
Your Profile
- Bachelor's or Master's degree in Engineering (Mechanical, Electrical, Industrial, Materials) or a related field. MBA is a plus.
- 12+ years in semiconductor, IC substrate or advanced electronics manufacturing.
- 8+ years of program or project leadership for large scale expansion or greenfield/cleanroom build out projects.
- Experience working with strategic global customers in technically demanding, high precision manufacturing environments.
- Proven ability to manage cross functional, complex, multi location teams.
- Strong understanding of IC substrate / advanced packaging manufacturing technologies (e.g., lamination, imaging, plating, laser drilling, AOI, ABF/resin systems).
- Deep knowledge of CapEx programs, factory expansion, cleanroom infrastructure, utilities and production facility concepts.
- Experience with MES/ERP, B2B integration, traceability, genealogy and manufacturing data flows.
- Familiarity with process qualification methodologies (DOE, PFMEA, CPK, reliability testing).
- Knowledge of semiconductor/electronics EHS, quality and regulatory frameworks.
Ready for a new challenge to advance your career Its just a click to apply online. We look forward to your application and your detailed resume. Your AT&S Team!
AT&S is an equal opportunity employer. We embrace diversity and are dedicated to empowering people to reach their potential by fostering their unique talents and strengths. Our compensation packages are competitive and take individual qualifications and experience into consideration.
