Design and develop semiconductor packages, including laminate substrate package layout, lead frame design, wire bonding schemes, and flip chip bump design
Your Role
Key responsibilities in your new role
- Design and develop semiconductor packages, including laminate substrate package layout, lead frame design, wire bonding schemes, and flip chip bump design
- Collaborate with product engineering teams to understand product requirements and develop package designs that meet those requirement
- Work with manufacturing teams to ensure that designed packages are manufacturable and meet production yield and quality target
- Develop and maintain design documentation, including package drawings, specifications, and design reports
- Conduct design reviews and ensure that designs meet company standards and industry regulations
- Troubleshoot package-related issues and implement design changes to resolve problems
- Stay up-to-date with industry trends and emerging technologies in semiconductor package design
- Collaborate with suppliers to develop and qualify new package materials and technologies
- Develop and maintain relationships with internal stakeholders, including product engineering, manufacturing, and quality assurance teams
Your Profile
Qualifications And Skills To Help You Succeed
- Bachelor's or Master's degree in Electrical Engineering, Mechanical Engineering, or related field
- Minimum 5 years of experience in semiconductor package design, preferably in the semiconductor industry
- Strong knowledge of semiconductor package design principles, including laminate substrate package layout, lead frame design, wire bonding schemes, and flip chip bump design
- Proficiency in CAD design tools, such as Cadence or Mentor Graphics
- Experience with design for manufacturability (DFM) and design for testability (DFT) principles
- Strong analytical and problem-solving skills, with the ability to troubleshoot complex package-related issues
- Excellent communication and collaboration skills, with the ability to work effectively with cross-functional teams
- Strong attention to detail and ability to maintain accurate and complete design documentation
#WeAreIn for driving decarbonization and digitalization.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in
We are on a journey to create the best Infineon for everyone.
This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicants experience and skills. Learn more about our various contact channels.
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