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Senior Supervisor, Failure Analysis Engineering

Senior Supervisor, Failure Analysis Engineering

ASE Global Group
2-5 Years
Not Disclosed
  • Posted 8 days ago
  • Be among the first 10 applicants

Job Description

Job Summary

The role will perform electrical and mechanical failure analysis to determine the failure mechanism. The engineer will utilize various failure analysis tools to identify the location of the failure and determine the failure mechanism.

Key Responsibilities:

  1. Conduct electrical and physical failure analysis, covering up to 1st die level analysis.
  2. Familiar with failure analysis tools and techniques such as SEM, EDX, curve trace, thermal hotspot analysis, X-ray, bench test, laser & chemical decapsulation, mechanical cross-section, die-level delayering and microprobing.
  3. Prepare detailed technical report documenting analysis methods, findings, conclusions, and recommendations.
  4. Able to correlate technical drawings and electrical circuit diagrams to the reported test failure.
  5. Maintenance and managing FA equipment and tools
  6. Able to lead and guide a group of FA technicians
  7. Prepare monthly report to the management on the failure analysis lot status and findings
  8. Able to collaborate with Product Engineering, Assembly Engineering, Test Engineering, Reliability Engineering and QA for issue/root cause identification.
  9. Support customer return investigations and quality escalations.

EDUCATION

  • Bachelor's in Mechanical/ Mechatronics/ Electronics & Electrical Engineering

EXPERIENCE

  • 2–5 years of experience in Failure Analysis, Semiconductor Manufacturing, Product Engineering, Reliability Engineering, or related fields.

COMPETENCIES

  • Strong analytical and problem-solving abilities.
  • Attention to detail and investigative mindset.
  • Effective written and verbal communication skills.
  • Ability to work independently and in cross-functional teams.
  • Good project management and prioritization skills.
  • Ability to handle multiple investigations in a fast-paced environment.

More Info

Key Skills

die-level delayering

thermal hotspot analysis

laser chemical decapsulation

microprobing

X-ray bench test

curve trace

mechanical cross-section

About Company

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