Signal Integrity Engineer

About CADFEM:

For over 40 years, the CADFEM Group has been a global leader in simulation-driven innovation, with a legacy rooted in decades of advancing numerical simulation. Founded in 1985 as an engineering office focused on simulation sales, support, and training, CADFEM has grown to become the world's largest Ansys Channel Partner, with a presence in over 20 countries.

As part of this international ecosystem, CADFEM APAC, a digital engineering implementation partner, carries forward the same legacy of excellence to the Indian and south-East Asian engineering community. We help organizations leverage Ansys technologies not just for physics-based simulations, but also as a foundation for digital engineering, workflow automation, and AI/ML-integrated CAE solutions to support industries such as Aerospace, Defense, Semiconductors & electronics, Automotive, Healthcare, and more.

We understand that software alone isn't enough. That's why we offer a complete ecosystem that includes simulation software, expert consulting, digital engineering services, customized IT and hardware infrastructure, AI-enhanced workflows, ongoing support, and hands-on training—all from a single, trusted source.

visit: cadfem.ai

Job Summary:

We are seeking a detail-oriented and technically skilled Application Engineer – Electronics, with strong expertise in SI/PI, EMI/EMC, and RF systems. The role involves aligning simulation solutions with customer challenges in SERDES, DDR, power electronics, antenna arrays, cosite interference, radomes, and FSS. It demands both domain depth and broad technical oversight across high-frequency electromagnetics..

Key Responsibilties:

o Lead and mentor a multi-domain presales team across SI/PI, EMI/EMC, and RF modalities.

o Architect and oversee the delivery of simulation solutions involving high-speed digital design, interference mitigation and RF component optimization.

o Support complex RF design evaluations including antenna arrays, Coiste placement Radome interaction and C-band satellite payload integration.

o Guide engagements that require modeling the likes of SERDES links, DDR buses, IGBT-based power modules, parasitics (R, L, G, C), and EMC shielding

o Collaborate effectively with the Go-To-Market (GMT) consultants within the ecosystem to guide the simulation positioning well aligned with a strategic roadmap.

o Represent the company in technical reviews, executive briefings, and key customer engagements.

Education:

Master's degree in Electrical, Electronics, or Communication Engineering, or a related field.

Experience:

Minimum 5 years of experience in SI/ PI, EMI/EMC, RF system design or simulation.

Technical & Business Skills:

o Deep understanding of Ansys software, FEM, and CAE applications.

o Strong understanding of electronic system design across component and system levels.

o Exposure to tools like HFSS, Slwave, EMA3D, CST, ADS, Feko or similar.

o Demonstrated ability to lead technical teams and manage cross-functional collaboration.

o Specialty in Modeling across select areas of key domains including Satellite RF Communication, Stealth Technology, High Speed Digital Communications, Power Modules and Flex PCBs.

o Exposure to the modelling of Semiconductor and 3DIC technology.