Staff Failure Analysis Engineer
Staff Failure Analysis Engineer
Sandisk- Posted 22 hours ago
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Job Description
Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today's needs and tomorrow's next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we're living in and that we have the power to shape.
Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.
Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.
Description
ESSENTIAL DUTIES AND RESPONSIBILITIES:
PREFERED:
Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.
Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [Confidential Information] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.
Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.
Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.
Description
ESSENTIAL DUTIES AND RESPONSIBILITIES:
- Perform detailed electrical and physical package failure analysis on assembly test failure from production, qualification and RMA.
- Define the FA flow for each FA case.
- Develop new FA processes, method and capability for new product and new technologies. Structure project plans and manages cost-effective execution of tasks. Maintain lab in quality system compliance.
- Hand-on FA tools (SEM, FIB, CSAM, X-ray, 3D X-ray, Thermal Emission) for defect localization and characterization.
- Collaborate with cross‑functional teams including process, quality, reliability, and product engineering teams to improve product reliability, yield, test coverage and RMA.
- Develop and present failure models based on findings.
- Provide clear FA reports, evidence, and recommendations to support corrective actions.
- Own FA tools, maintain procedures, and improve analysis methodologies.
- Mentor junior engineers in FA techniques and best practices.
- Help expand lab capabilities by exploring new tools and methods to enhance failure analysis.
PREFERED:
- Bachelor's degree and/or master's in electrical & Electronic or Material Engineering with minimum 5 years experience in failure analysis.
- Expert in FA instruments and able to apply advanced technical principle to complete complex tasks, including 3D X-ray, CSAM, SEM/EDX, chemical decapsulation, TDR, curve tracer analysis, optical microscopes, FIB and TEM.
- Familiar with package and device analysis methodology.
- Familiar with semiconductor and SMT assembly process and technology.
- Familiar with memory product technology and structure.
- Understand memory product test process and methodology.
- Strong memory IC de-processing skills.
- Good communication, presentation skills and teamwork spirit.
- Fluent in English speaking, reading and technical FA report writing.
- Previous electrical FA experience in IC or memory devices is preferred.
- Technical report writing and presentation skills, ability to troubleshoot and analyze complex problems.
Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.
Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [Confidential Information] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.
More Info
Job Type:
Industry:
Employment Type:
Key Skills
Electrical and physical package failure analysis
3D X-ray
Semiconductor and SMT assembly process and technology
TDR curve tracer analysis
Package and device analysis methodology
Memory product technology and structure
Memory IC de-processing
Optical microscopes
TEM
Memory product test process and methodology
Chemical decapsulation

