WIRE BOND ENGINEER

Wire Bond Engineer

Job Summary

We are seeking a competent and results-driven Wire Bond Engineer to manage, develop, and optimize wire bonding processes within a semiconductor manufacturing environment. This role is responsible for process performance, yield improvement, quality assurance, and productivity enhancement while supporting new product introductions and continuous improvement initiatives.

The successful candidate will provide technical leadership, hands-on engineering support, and cross-functional collaboration to ensure stable production, compliance with customer requirements, and achievement of operational excellence.

Key Responsibilities

• Develop, optimize, qualify, and sustain wire bonding processes to achieve targeted yield, quality, productivity, and cost efficiency.
• Provide hands-on technical support and troubleshooting for complex wire bond process-related issues.
• Train, guide, and supervise engineers, process technicians, and engineering operators to drive effective teamwork and operational excellence.
• Monitor and analyze process performance, yield trends, and defect data, and implement corrective and preventive actions.
• Establish and maintain standard UPH (Units Per Hour), standard operating procedures (SOPs), and material requirements for new and existing equipment and processes.
• Support New Product Introduction (NPI), engineering trials, qualification lots, and production ramp-up activities.
• Drive continuous improvement initiatives, including the development of new processes and sourcing of materials or equipment.
• Collaborate with cross-functional teams such as Production, Quality, Equipment, and R&D to resolve process and quality issues.
• Review, interpret, and ensure compliance with customer specifications and technical requirements.
• Improve and update process flows, documentation, and specifications to reflect customer changes or internal developments.
• Take ownership of quality-related issues including VOC (Voice of Customer), VOP (Voice of Process), MRB (Material Review Board), and CAPA (Corrective and Preventive Actions), ensuring effective controls and audit readiness.
• Work closely with Quality and Reliability teams on failure analysis and customer-related concerns.
• Ensure adherence to internal quality standards, safety regulations, and industry best practices.
• Perform other duties and responsibilities as assigned by the immediate superior.

Requirements

• Bachelor's Degree in Engineering (Electrical, Electronic, Mechanical, Materials, or related discipline).
• Minimum 2–5 years of relevant experience in wire bonding or semiconductor backend manufacturing.
• Strong knowledge of wire bonding technologies including ball bonding, wedge bonding, and gold/copper wire processes.
• Hands-on experience with wire bonding equipment (e.g. ASM, Kulicke & Soffa, or equivalent platforms).
• Familiarity with process control and quality tools such as SPC, FMEA, DOE, and root cause analysis.
• Experience handling high-volume manufacturing environments and customer-driven requirements is an advantage.
• Strong analytical, problem-solving, and troubleshooting capabilities.
• Effective communication, leadership, and cross-functional collaboration skills.
• Ability to work independently with minimal supervision in a fast-paced manufacturing environment.