Solidworks, Excel, wire bonding, 3D CAD software, die attach, optical alignment, Optics, E-drawings, Jmp, six-sigma

statistical data analysis , Fmea, Statistical Validation, FCBGA, 8 basic QC tools

wire bonding, Data Analysis, die bonding, Spc, Troubleshooting, Doe, yield improvement, process setup optimization, process characterization, statistical methods, CPK

manufacturing process control techniques, statistical process control methods and tools, semiconductor equipment manufacturing process control, process improvement, process characterization, equipment monitoring and adjustment, problem-solving methodologies

wafer thinning, DOE matrix design, Spc, Process Optimization, wafer grinding, wafer dicing, silicon photonic chips, Jmp

Best practices in mechanical assembly and assembly jig fixture design, Ultrasonic resistance welding and heat staking process, Poka-yoke design and Design for Assembly guideline design rules, SMT process for Flex and PCBA, SMT DFM process, Mechanical assembly process, Vacuum leak test requirement and troubleshooting

CPK, Root-cause analysis, Mechanical systems and material behavior, Doe, Spc, failure investigation, variability reduction, Production ramp, Process Control, equipment qualification

bop , Correlation, Spc, Yield analysis, T-test, Tolerance, Regression, PPK, Dfm, Extrusion Process, Doe, FACA, CPK, P-FMEA

Spotfire, Minitab, Spc, Doe, Jmp, Problem Solving