Advanced metrology and failure analysis techniques, SolidWorks CAD software

Excel, Statistical Analysis, Word, SPC Statistical Process Control, Powerpoint, Autocad, leadframe laminate, wire-bonding, wafer Front-Side FSM, flip-chip packaging, Power SiP modules, multi-chip module, Back-Side BM Metallization processing

substrate supplier, Materials, yield, Fabless IDM, Reliability, advanced packaging technologies, cost effective substrate solutions, process flows, OSAT, packaging and board design rules, manufacturability

Electroplating, Dicing, Yield SPC improvement, Etching, Fmea, Spc, SPC 8D, FCBGA COW, Msa, Doe, sputtering, Grinding, photolithography